Product & Service
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Maximum layer count: 4 layers (2 and 3 layers are flexible boards) Board thickness: 1.7 mm Minimum trace width/minimum spacing: 0.1/0.1 Surface finish: ENIG
Single-sided, double-layer aluminum substrate
Maximum layers: 3; Board thickness: 2.0 mm; Minimum trace width/minimum spacing: 0.3/0.3 mm; Surface finish: Lead‑based hot air solder leveling.
Maximum layer count: 8 layers; Board thickness: 1.2 mm; Minimum trace width/minimum spacing: 0.075 mm / 0.075 mm; Surface finish: ENIG (Electroless Nickel Immersion Gold)
Maximum layers: 8; Board thickness: 0.8 mm; Minimum trace width/minimum spacing: 0.075 mm / 0.075 mm; Surface finish: ENIG + anti-oxidation.
High-Density Multilayer – 16-Layer PCB
Maximum layers: 16; Board thickness: 2.4 mm; Minimum trace width/minimum spacing: 0.1 mm / 0.1 mm; Surface finish: ENIG (Electroless Nickel Immersion Gold)
Maximum layers: 12; Board thickness: 2.0 mm; Minimum trace width/minimum spacing: 0.1/0.1 mm; Surface finish: ENIG (Electroless Nickel Immersion Gold)
Maximum number of layers: 10; Board thickness: 2.9 mm; Minimum trace width/minimum spacing: 0.2/0.2 mm (for 2 oz thick copper, return‑path traces); Surface finish: lead‑free hot‑air solder leveling.
Maximum layer count: 8 layers; Board thickness: 1.9 mm; Minimum trace width/minimum spacing: 0.5/0.15 mm; Surface finish: Immersion nickel–gold (with deep‑etching treatment).
Ten-layer rigid-flex circuit board
Maximum number of layers: 10 (with flexible boards on layers 5 and 6) Board thickness: 1.9 mm Minimum trace width/minimum spacing: 0.1 mm / 0.1 mm Surface finish: ENIG
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