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Single-sided, double-layer aluminum substrate
Maximum layers: 3; Board thickness: 2.0 mm; Minimum trace width/minimum spacing: 0.3/0.3 mm; Surface finish: Lead‑based hot air solder leveling.
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Single-sided, double-layer aluminum substrate
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Maximum number of floors: 3 floors
Plate thickness: 2.0
Minimum line width/minimum spacing: 0.3/0.3
Surface finish: Lead-based hot air reflow
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