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Power board
Maximum number of layers: 10; Board thickness: 2.9 mm; Minimum trace width/minimum spacing: 0.2/0.2 mm (for 2 oz thick copper, return‑path traces); Surface finish: lead‑free hot‑air solder leveling.
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Power board
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Maximum number of floors: 10 floors
Plate thickness: 2.9
Minimum trace width/minimum spacing: 0.2/0.2 (2 oz thick copper, return coil)
Surface Treatment: Lead-Free Hot Air
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