Pulin Company’s CPCA Forum has achieved remarkable results.

　　From March 14 to 16, 2011, the “2011 Spring International PCB Technology/Information Forum,” hosted by the China Printed Circuit Association (CPCA), was held in Shanghai. This forum is a high‑profile, technologically advanced event within the PCB industry. Tianjin Pulin Circuit Co., Ltd., as a director unit of the CPCA, attached great importance to it and actively participated in all aspects of the program. Company leader and General Manager Tang Yanling personally led Pulin’s technical experts to Shanghai and served as the moderator of the “2011 Spring International PCB Technology/Information Forum,” presiding over this major gathering.

　　The “International PCB Technology/Information Forum” is held twice annually, in spring and autumn. This year’s spring forum was themed “Innovation, Adjustment, and Transformation,” with paper topics covering new technologies in printed circuit manufacturing, advances in materials and equipment, innovations in testing and interconnection, cutting-edge approaches to environmental protection and clean production, as well as market dynamics and management practices within the printed circuit industry. At this technical forum, Plin Company not only submitted 13 outstanding technical papers to CPCA but also had three papers authored by Wu Zhihui, Chen Yongsheng, and Wu Yunpeng selected by the CPCA expert review committee as presentation papers for the conference. Representing Plin, these authors took the stage to deliver presentations on “Sharing Insights from Safety Assessment and Audit Work,” “Research on Buried-Via Processing Technology for HDI Products,” and “Analysis and Improvement of Blind-Via Plating Issues,” earning unanimous praise from attendees.
　　In addition, the conference held an awards ceremony for the 2010 Forum’s Outstanding Papers. Among them, three papers—“Research on the Capability of Micro‑via Copper Plating in Printed Circuit Boards” by Liu Lu of Tianjin Pulinn Co., Ltd., “Research on Thick‑Copper Core Boards and a Lamination Method for High‑Resin‑Content Multilayer Structures” by Huang Zhen, and “Optimization Study of Alignment Systems for HDI Products” by Li Xin—were unanimously selected by the CPCA Science and Technology Committee as the “2010 Forum Outstanding Papers” and were awarded certificates of excellence along with cash prizes of RMB 500 each.

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