A Glimpse of the 2011 Autumn International PCB Technology Information Forum

The 2011 China–Japan Autumn Conference on Electronic Circuits and the Autumn International PCB Technology Information Forum, organized by the Science and Technology Committee of the China Printed Circuit Industry Association, was held in Dongguan, Guangdong, on October 20–21, 2011. Tianjin Pulinn sent a delegation of nine members, led by Director Li Xiumin, to attend the event. Over the two-day conference, seven special keynote presentations were delivered, providing detailed insights into the development of the printed circuit board industry, cutting-edge technologies, and related sectors within the PCB value chain—including LEDs and chip packaging. In addition, 33 specialized technical sessions were held, covering topics such as PCB substrates, environmental regulations, product testing, reliability, and product design.

　　The 2011 China–Japan Autumn Conference on Electronic Circuits and the Autumn International PCB Technology Information Forum, organized by the Science and Technology Committee of the China Printed Circuit Industry Association, was held in Dongguan, Guangdong, on October 20–21, 2011. Tianjin Pulinn sent a delegation of nine members, led by Director Li Xiumin, to attend the event. Over the two-day conference, seven special keynote presentations were delivered, providing detailed insights into the development of the printed circuit board industry, cutting-edge technologies, and related sectors such as LEDs and chip packaging. In addition, 33 specialized technical sessions covered topics including printed circuit board substrates, environmental regulations, product testing, reliability, product design, and advanced manufacturing techniques for specialty boards.

　　Tianjin Pulinn submitted eight papers this time, with three of them selected for inclusion in the conference proceedings. Among these, “The Impact of Humidity Cards on PCB Surface and Performance,” authored by Zhang Qiurong et al., and “Application of Thermal Analysis Techniques in PCB Performance Testing,” written by Pei Xu, were presented as oral presentations at the forum. On November 17, the company held a summary report meeting for the forum, along with a briefing on preparations for spring‑2012 submissions. General Manager Tang Yanling attended the meeting, during which awards were conferred on the authors whose papers were chosen for presentation. At the conclusion of the meeting, General Manager Tang urged all engineers to make full use of their spare time, demonstrating a strong sense of responsibility, professional dedication, and a spirit of innovation, and to seize opportunities presented by the PCB Technology and Information Forum to submit at least one paper. She also instructed relevant department heads to establish an internal peer‑review mechanism to rigorously evaluate each submission, with the company providing appropriate incentives.

　　　　　　　　　　　　　　　　　　　　　　　　　　 Chen Yongsheng