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32-layer buried blind via process, double-sided copper structure, aerospace-grade HDI printed circuit board
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32-layer buried blind via process, double-sided copper structure, aerospace-grade HDI printed circuit board
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Plate thickness: 3.2 mm
Core material 0.05 mm, 0.08 mm
Inner-layer yin-yang copper structure
Blind hole: 0.125 mm
Electroplating via‑fill process
Two impedance values: 50 Ω and 100 Ω.
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